TE Connectivity AMP Connectors 2-2129710-5, LGA socket, 3647 positions, gold mating finish 30.0µin (0.76µm), 0.5 A per contact, open frame, surface mount solder termination, UL94 V-0 thermoplastic housing, tray package.
| Parameter | Value |
|---|---|
| Type | LGA |
| Mounting | Surface Mount |
| Current rating | 0.5 A |
| Housing material | Thermoplastic |
| Contact material - post | Copper Alloy |
| Contact material - mating | Copper Alloy |
| Material flammability rating | UL94 V-0 |
| Package | Tray |
| Features | Open Frame |
| Termination | Solder |
| Contact finish - mating | Gold |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
| Number of positions or pins | 3647 |
The 2-2129710-5: This TE Connectivity LGA socket packs 3647 positions in an open-frame design, matching the land-grid array footprint used by Intel Xeon Scalable processors (Purley platform). Surface-mount solder termination and UL94 V-0 thermoplastic housing suit reflow assembly in server motherboards and high-end workstations.
ROHS3 compliant, sourced per RFQ against BOM quantities.
Yes, the 3647-position LGA socket is designed for Intel Xeon Scalable processors (Purley platform). Confirm your specific processor model's socket compatibility before ordering.
Rated 0.5 A per contact, typical for high-density LGA signal sockets used in processor applications.