TE Connectivity AMP Connectors, LGA socket, 3647 positions, open frame, surface mount, gold 30.0µin mating finish, 0.5 A per contact, UL94 V-0 thermoplastic housing, tray package.
| Parameter | Value |
|---|---|
| Type | LGA |
| Mounting | Surface Mount |
| Current rating | 0.5 A |
| Housing material | Thermoplastic |
| Contact material - post | Copper Alloy |
| Contact material - mating | Copper Alloy |
| Material flammability rating | UL94 V-0 |
| Package | Tray |
| Features | Open Frame |
| Termination | Solder |
| Contact finish - mating | Gold |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
| Number of positions or pins | 3647 |
The 2-2129710-6: This is a 3647-position LGA socket from TE Connectivity, designed to accept Intel Xeon Scalable processors (Socket P) — the pin count matches that platform directly. The open-frame construction lets the processor backside capacitor array sit clear of the socket body.
Termination is solder, surface mount — the socket reflows onto the motherboard pads in a standard SMT oven profile.
Yes, the 3647-position LGA socket matches the Intel Xeon Scalable Socket P (LGA3647) footprint. The open-frame design accommodates the processor's backside capacitors.
Rated 0.5 A per contact. This is a signal-level socket; each pin carries low current, typical for high-density processor interfaces.
Surface mount with solder termination. The socket reflows onto the motherboard in an SMT process.
Yes, it is ROHS3 compliant per the manufacturer's listing.