TE Connectivity CHAMP.050 I series, Board to Board High Density Receptacle, 40 Positions, 2 Rows, Through Hole Solder, Gold 8.00µin Contact Finish, Board Lock
| Parameter | Value |
|---|---|
| Type | Board to Board, High Density |
| Series | CHAMP .050 I |
| Mounting | Through Hole |
| Connector type | Outer Shroud Contacts |
| Package | Tray |
| Features | Board Lock |
| Termination | Solder |
| Contact finish | Gold |
| Rows | 2 |
| Positions | 40 |
| Contact finish thickness | 8.00µin (0.203µm) |
This is a practical advantage in high-density layouts where the connector sits close to other components — the lock prevents the part from shifting during wave solder and reduces the risk of lifted pads from cable strain.
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The 5175475-5 is a 40-position receptacle arranged in two rows, with outer shroud contacts. It is a board-to-board high-density connector with through-hole solder termination and a board lock feature.