Board-Edge D-Sub for Signal-Density I/O
The TE Connectivity 5787169-7 is a 68-position D-sub receptacle from the AMPLIMITE.050 III series, designed for board-edge mounting with right-angle through-hole solder termination. Its 0.050-inch contact pitch paired with 0.100-inch row spacing packs 68 signal contacts into a shell size that would normally carry 50 positions on a standard-density D-sub — this is the high-density layout that suits parallel data interfaces, SCSI-style buses, or any application where a wide signal bundle must exit a PCB edge through a single shielded connector. The connector carries gold-plated phosphor bronze contacts rated 1 A per circuit at 30 V, confirming its role as a signal-path interconnect rather than a power delivery point. The shielded steel shell with nickel plating and a 4-40 threaded flange provides EMI containment and mechanical retention to the mating plug — the flange screws are what keep the shield ground continuous and the contacts mated under vibration or cable strain.
The backset spacing of 0.146" (3.71 mm) defines how far the connector body stands off from the board edge — this dimension determines the clearance needed between the PCB edge and any adjacent components or enclosure walls.
Mating Half and Pinout Reality
This receptacle mates with a standard AMPLIMITE.050 III series plug (male pin) connector — the same shell size and 0.050-inch pitch layout. The pinout follows the standard D-sub high-density arrangement for 68 positions: two rows of 34 contacts, with the shell keyed by the D-shape to prevent misorientation. The 4-40 threaded female inserts on the receptacle accept the mating plug's jackscrews, so the pair is locked together mechanically — this is standard for any shielded D-sub installation where the cable is routed through a panel or conduit.