TE Connectivity AMPMODU System 50 header, order code 104071-1, 10 positions, single row, 1.27 mm pitch, 30 VAC, gold-plated mating contacts, through-hole, solder termination.
| Parameter | Value |
|---|---|
| Series | AMPMODU System 50 |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Latch Holder |
| Voltage rating | 30VAC |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.390\" (9.91mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Tube |
| Shrouding | Shrouded - 2 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Telecommunications |
| Contact shape | Circular |
| Rows | 1 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 10 |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.100\" (2.54mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.125\" (3.18mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 104071-1 is the 10-position member of TE Connectivity's AMPMODU System 50 header line, a board-to-board or cable interconnect with a 1.27 mm pitch.
The 1.27 mm pitch drives a compact board footprint suited for dense routing; the single-row 10-position layout matches low-circuit-count signal or power applications.