The 10075024-G01-07ULF: The 0.079" row spacing mirrors the pitch, which keeps the routing symmetrical and the keep-out zone predictable for a board-to-board or cable interconnect. For a header that sees repeated connects in a harness assembly or a test fixture, the gold layer resists oxidation and maintains contact resistance through hundreds of cycles.
For a signal-level interconnect on a control board or sensor interface, 2A per pin is ample; for a power rail you'd need to parallel multiple pins or step up to a higher-current header.
Mechanical fit and mounting
The insulation height is only 0.059" above the board, keeping the profile low for tight enclosures.