
Amphenol ICC BERGSTIK 10076801-101-12LF, 12-Position 2.54 mm Header
MPN10076801-101-12LF
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Amphenol ICC BERGSTIK 10076801-101-12LF, dual-row board-to-board header, 12 positions (6×2), 0.100-inch (2.54 mm) pitch, gold-on-mating / tin solder-tail plating, 3 A per contact, -65 to 130 °C operating, UL94 V-0 thermoplastic housing, push-pull fastening, through-hole mount.
$0.4570Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C ~ 130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.112\" (2.85mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 12 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.098\" (2.50mm) |
| Overall contact length | 0.440\" (11.18mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What is the 10076801-101-12LF's listed style and series?
The 10076801-101-12LF is listed as Style Board to Board in the Amphenol ICC BERGSTIK series — a standard dual-row breakaway header family for board-to-board signal and low-power interconnects.