The 10112690-G03-02LF: Surface-mount right-angle orientation means the solder tails exit the side of the body, not the bottom. Dual-row 2.00 mm pitch with 0.079" row spacing gives a symmetrical 4-pin grid.
The post (solder tail) is tin-plated at 78.7 µinch, which is compatible with standard SAC reflow profiles. Gold on the mating face and tin on the tail is a common split that balances signal integrity at the interface with solderability at the board.
