The 10125839-06RAEHLF: The header is surface-mount, right-angle, with solder termination. The Solder Retention feature provides additional mechanical hold during reflow and against cable strain. The 1.20 mm pitch demands a precise PCB footprint — the board layout engineer should confirm the pad pattern against the product drawing to avoid routing conflicts with adjacent components.
Amphenol ICC (FCI) 10125839-06RAEHLF, 6-position, 1.20mm pitch, surface-mount right-angle shrouded header, gold-plated contacts, detent lock, UL94 V-0, Tape & Reel.
$0.5200Ref. price · indicative, final on quote
StockContact for availability
Lead time3-5 Days wk
MOQ1 pcs
- New & original stockTraceable channels only — no mixed lots, no re-taped reels.
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Specifications
| Parameter | Value |
|---|---|
| Gender | Tab |
| Mounting type | Surface Mount, Right Angle |
| Connector type | Receptacle |
| Fastening type | Detent Lock |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.098\" (2.50mm) |
| Insulation material | Liquid Crystal Polymer (LCP), Halogen Free |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Features | Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Rectangular |
| Rows | 1 |
| Pitch | 0.047\" (1.20mm) |
| Positions | 6 |
| Contact finish - post | Gold |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 2.00µin (0.051µm) |
| Contact finish thickness - mating | 3.90µin (0.099µm) |
Product details
Frequently asked questions
Is 10125839-06RAEHLF RoHS compliant?
Yes, the 10125839-06RAEHLF is RoHS compliant per the manufacturer's listing.
What is the recommended PCB layout for 10125839-06RAEHLF?
The connector is a 6-position, 1.20 mm pitch, single-row, right-angle SMT header. The PCB footprint should match the product drawing for pad dimensions and keep-out zones. The Solder Retention feature helps anchor the part during reflow, but the board layout engineer should verify the pad pattern against the official drawing to ensure proper alignment and solder joint reliability.