The 10127820-1821LF: The 4.20 mm pitch and 600 VAC/DC rating place it in the power distribution role — feeding a board from a harness or routing higher-voltage signals between panels. Gold flash on the male pins protects the contact interface during storage and initial mating, but flash thickness (typically under 10 µinch) limits repeated mate/unmate cycles — this is a fit-and-forget interconnect, not a frequent-disconnect port.
The 0.165" (4.20 mm) pitch and 0.165" (4.20 mm) row spacing set a 9.0 mm × 4.2 mm grid per row pair. The 0.138" (3.50 mm) solder post length gives enough stand-off for wave solder clearance on a standard 1.6 mm board. Through-hole mounting with a shrouded 4-wall design keeps the pins aligned during insertion and protects them from accidental shorting against adjacent components. Compared to the 12-position sibling (10127820-1221LF) or the 24-position (10127820-2421LF), this 18-position version fills a middle ground — 9 circuits per row, which suits a 3-phase power input plus neutral and ground, or a multi-channel sensor bank.
No stock-holding claim — each order is confirmed through independent distribution channels.
Termination is solder — through-hole pins are designed for wave or hand soldering. The contact material is brass with gold flash, compatible with standard lead-free solder profiles. The insulation material is PA66 (Nylon 6/6), rated UL94 V-0 for flammability.