40-Position Mezzanine Receptacle at 0.50mm Pitch
It uses a 0.020" (0.50mm) pitch in a 2-row arrangement with center strip contacts, making it a dense signal interconnect for parallel PCB assemblies. The surface-mount termination and board guide features simplify alignment during reflow assembly, while the solder retention tails hold the part in place through the solder process. Mated stacking heights span 3mm, 3.5mm, 4mm, and 4.5mm — a range that gives the board-stacking engineer flexibility in z-height budget without changing the receptacle footprint.
The 0.50mm pitch and 2-row layout set the PCB footprint — the pad pattern is tight, so the layout engineer needs the manufacturer's recommended land pattern to avoid shorts between adjacent pads. The 0.085" (2.16mm) height above board keeps the connector profile low, which matters when the mezzanine gap is constrained. The board guide feature takes up misalignment during mating, protecting the fine-pitch contacts from damage.
Contact Finish and Mating Duty
Contacts are finished with gold, with a contact finish thickness of 1.00µin (0.025µm). That is a gold flash — adequate for the limited mating cycles typical of a mezzanine stack that is assembled once and rarely disconnected in the field. For applications requiring frequent reconnection, a thicker gold plate would be preferable, but for a fixed board-to-board interconnect this flash is standard.