Board-to-board stacking with a 1.27 mm pitch
The pick-and-place feature allows automated SMT placement — the vacuum pick-up area is flat and centred, compatible with standard 8 mm or 12 mm nozzles.
Sourcing and compliance snapshot
The brass contacts with tin-plated posts provide a reliable solder joint to the PCB pad.
The surface-mount termination with solder tails suits reflow assembly. The tape-and-reel packaging feeds directly into a pick-and-place machine — no manual handling required for volume production.