It carries 100 positions on a 0.016" (0.40mm) pitch in a dual-row layout, with a low profile of 0.045" (1.14mm) above the board. The gold flash contact finish suits moderate mating-cycle applications typical of internal device interconnects. Mated stacking heights range from 1.5mm to 4mm, giving flexibility for different board-spacing requirements in portable devices, telecom modules, or industrial control cards.
Mated Stacking Heights — Choosing the Right Gap
The 10164228-1001A1RLF supports six mated stacking heights: 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, and 4mm. This range covers tight board-to-board spacing in handheld gear (1.5mm) up to more generous gaps for component clearance or airflow (4mm).
The 80-position sibling 10164228-0801A1RLF shares the same 0.016" (0.40mm) pitch, 0.045" (1.14mm) height above board, dual-row layout, and gold flash contacts. If your design needs fewer than 100 circuits, the 80-position variant saves board space without changing the footprint pitch.