1.27 mm Pitch, 6 Positions – Board-to-Board Signal Header
The 20021111-00006T1LF: This is an unshrouded dual-row pin header from the Minitek127® 1.27mm series, with 6 positions on a 1.27 mm pitch and a row spacing of 1.27 mm. The 0.050" pitch sets the board footprint density — at 6 circuits it's a compact signal interconnect for board-to-board stacking where the mating receptacle sits on a parallel PCB. The 125 VAC rating covers typical logic-level and low-voltage power rails.
Gold Flash on Mating, Tin on Post – Contact Finish Strategy
The solder post gets a 50 µinch tin finish, which wets well in wave or hand-solder processes. If you expect frequent board swaps or field rework, consider a thicker gold plating option in the same series.
Through-Hole, Unshrouded – What It Means for Assembly
RoHS compliant per the listed compliance status.