Board-to-Board Sizing on a 1.27 mm Pitch
The 20021111-00008T1LF: This is an 8-position, dual-row unshrouded header on 1.27 mm pitch, part of the Minitek127 series from Amphenol ICC. The 0.050" row spacing and 0.098" insulation height set a compact footprint for parallel board stacking where the mating receptacle sits at a fixed standoff.
Mating contact finish is gold flash — enough for corrosion resistance in low-cycle signal applications, but not rated for repeated disconnect/reconnect. The solder post is tin-plated at 50 µinch, which wets well in wave or hand solder processes.