12 positions at 1.27 mm pitch — board-to-board signal interconnect
The 20021112-00012T4LF: This is a 12-position, dual-row header from the Minitek127® 1.27mm series by Amphenol ICC (FCI). The 1.27 mm pitch and 0.050" row spacing define a compact footprint for board-to-board stacking or wire-to-board harnesses. Unshrouded pins allow direct access for probing or manual wiring but leave the contacts exposed — plan for a mating housing that provides its own shroud.
Gold mating face, tin post — 10 µinch over 50 µinch
Gold on the mating interface gives reliable contact resistance over repeated connect/disconnect cycles — suitable for field-service or test-point applications where the header sees regular engagement. Tin on the post is standard for soldering into plated through-holes; the thicker tin layer protects the copper alloy during reflow.