Board-to-Board Stacking with 1.27 mm Pitch
The 20021121-00004T4LF: The SMT termination keeps the profile low for mezzanine or parallel-board stacking where z-height is tight.
Gold Mating Finish — Signal-Grade, Not High-Cycle
The mating contact carries 10 µinch gold over copper alloy, while the solder posts are tin-plated (50 µinch). The 10 µinch gold is a signal-grade finish — adequate for occasional disconnect in a lab or field-service scenario, but not for frequent mating cycles (500+). For a production board that stays mated, the gold prevents corrosion on the contact interface.
Sourcing and Lifecycle — Active, RoHS, Tube Package
This is an unshrouded header — it mates with any Minitek127 1.27 mm pitch receptacle or IDC socket that accepts a 0.050" row spacing and 0.120" pin length. The SMT footprint requires a 1.27 mm pitch pad layout in both rows. Confirm the board stack-up and solder paste stencil thickness for the 0.050" row spacing — the narrow pitch demands careful pad design to avoid bridging.