Board-to-Board Signal Header: 1.27 mm Pitch, 8 Positions, SMT
The 20021121-00008C1LF: It is a board-to-board interconnect with a 1.27 mm pitch and a 1.27 mm row spacing, designed for surface-mount soldering on a PCB. Gold flash provides a reliable contact interface for moderate mating cycles, while the tin post ensures good solderability to the PCB pad. In a vibration environment, additional mechanical support (board locks or potting) may be needed.
Termination is surface-mount solder, and the header includes a pick-and-place feature for automated assembly. The tape-and-reel packaging (cut tape available) supports high-volume placement.
RoHS compliant.