Amphenol ICC (FCI) Minitek127 1.27mm, Board to Board Header, 8 positions, dual-row, SMT, unshrouded male pins, gold mating finish, rated 1 A per contact at 125 VAC, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | Minitek127® 1.27mm |
| Gender | Male Pin |
| Mounting type | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 125VAC |
| Current rating | 1A per Contact |
| Operating temperature | -55°C~125°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 8 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.120\" (3.05mm) |
| Contact finish thickness - post | 50.0µin (1.27µm) |
| Contact finish thickness - mating | 10.0µin (0.25µm) |
The 20021121-00008T4LF is an 8-position, dual-row unshrouded header from the Minitek127 1.27mm series. The 1.27mm pitch and row spacing set a compact footprint for board-to-board stacking, with SMT solder tails that keep the profile low on the PCB. The gold mating finish (10 µinch) gives reliable contact over repeated mates, while the tin post finish handles the solder joint.
The 20021121-00008T4LF is sourced through independent distribution.
The sibling 20021121-00008T1LF is identical in pitch, position count, and mounting, but uses flash gold instead of 10 µinch gold on the mating surface. For applications requiring a defined gold thickness, the T4LF is the better fit.