1.27mm Pitch, 10 Positions, SMT — Board Density Fit
The 20021121-00010C8LF: The 1.27mm pitch is the tightest standard for board-to-board stacking without going to fine-pitch FFC — it lets you route a trace between pads on a 2-layer board with 0.2mm track/space, which keeps the PCB cost down. The 0.120" (3.05mm) mating pin length gives enough wipe for a standard 1.27mm IDC socket or a shrouded header receptacle.
Gold GXT Mating Finish — 30µin for 500+ Cycles
The solder tails are tin-plated (50.0µin), which is the right choice for lead-free reflow compatibility.
1A Per Contact — Signal-Level Current Budget
Rated 1A per contact at 125VAC. This is a signal interconnect, not a power rail; budget it for logic-level, I/O, or low-current sensor lines.
Active Production, Tape & Reel, Pick-and-Place Ready
Supplied on Tape & Reel with Pick and Place feature, so it feeds straight into a standard SMT line. RoHS compliant.
Peer Comparison — 20021121-00010D8LF vs 20021121-00010C4LF
The closest sibling is 20021121-00010D8LF — identical in every spec (10 positions, gold GXT, 30µin) except packaged in Tube instead of Tape & Reel. If your line feeds from a tube feeder, that's the one. The other peer, 20021121-00010C4LF, drops the mating finish to 10.0µin gold — half the cycle life — so if you need the full 500-cycle durability, stick with the C8LF suffix.