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Amphenol 20021121-00012D4LF — Pin Headers, Sockets & Housings

Amphenol ICC 20021121-00012D4LF Header, 12-Pos 1.27mm

MPN20021121-00012D4LF
Active

Amphenol ICC (FCI) Minitek127® 1.27mm header, order code 20021121-00012D4LF, 12 positions, dual row, 0.050" (1.27mm) pitch, 1A per contact, 125VAC, gold-plated mating contacts, surface-mount, solder termination.

$0.5720Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

20021121-00012D4LF key specifications
ParameterValue
SeriesMinitek127® 1.27mm
TypeMale Pin
MountingSurface Mount
Connector typeHeader
Fastening typePush-Pull
Voltage rating125VAC
Current rating1A per Contact
Operating temperature-55°C~125°C
Contact materialCopper Alloy
Insulation colorBlack
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

20021121-00012D4LF additional specifications
ParameterValue
StyleBoard to Board
PackageTube
FeaturesPick and Place
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.050\" (1.27mm)
Positions12
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin
Contact finish - matingGold
Contact length - mating0.120\" (3.05mm)
Contact finish thickness - post50.0µin (1.27µm)
Contact finish thickness - mating10.0µin (0.25µm)

Product details

1A per contact, 125VAC signal duty

The 20021121-00012D4LF is the 12-circuit member of Amphenol ICC's Minitek127® 1.27mm board-to-board header line. Rated 1A per contact at 125VAC with gold-plated mating contacts, this unshrouded header suits low-power signal interconnects between parallel PCBs.

Unshrouded push-pull, SMT mount

The header uses a push-pull fastening system with square male pins in a dual-row arrangement at 0.050" (1.27mm) pitch and row spacing. Surface-mount solder termination and pick-and-place compatible packaging support automated assembly.