Board-to-Board Stacking Fit
The 20021121-00014C8LF: The tin-plated solder tails (50 µinch) are compatible with standard SAC305 solder profiles.
SMT Assembly and Pick-and-Place Ready
This avoids the need for a separate nozzle adapter on high-speed SMT lines. The UL94 V-0 thermoplastic housing withstands reflow temperatures without deformation.
This is a signal-level interconnect; for power delivery above 1 A per circuit, a wider-pitch series would be more appropriate.
