Pitch, row spacing, and board footprint
The 20021121-00018T8LF: Both the mating pitch and the row spacing are 0.050" (1.27 mm), so the 18 positions occupy a compact 9.53 mm board footprint across the dual rows.

Amphenol ICC (FCI) Minitek127® 1.27mm header, order code 20021121-00018T8LF, 18 positions, dual row, 1.27 mm pitch, 1 A per contact, 125 VAC, gold GXT™ mating contacts, surface-mount, solder termination.
| Parameter | Value |
|---|---|
| Series | Minitek127® 1.27mm |
| Gender | Male Pin |
| Mounting type | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 125VAC |
| Current rating | 1A per Contact |
| Operating temperature | -55°C~125°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 18 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.120\" (3.05mm) |
| Contact finish thickness - post | 50.0µin (1.27µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 20021121-00018T8LF: Both the mating pitch and the row spacing are 0.050" (1.27 mm), so the 18 positions occupy a compact 9.53 mm board footprint across the dual rows.
The style is Board to Board.