Board-to-Board Header for Dense SMT Stacks
The 20021121-00030T1LF: This is a 30-position, dual-row unshrouded header from the Minitek127® 1.27mm series by Amphenol ICC (FCI).
SMT Termination and Board Layout Fit
Surface-mount termination means this header reflows with the rest of the SMT components — no through-hole tails to hand-solder or wave-solder. The unshrouded design gives you visual access to the solder joints for inspection, but it also means the pins are exposed and can be bent if the mating connector is misaligned during assembly.
Gold Mating Finish for Repeated Mating Cycles
The mating contact finish is gold — flash thickness, which is the thinnest gold layer in the Minitek127 range. The post (solder tail) finish is tin, which is standard for SMT reflow compatibility.
No official second-source cross-reference exists from JST or Molex for this exact footprint and pinout.