40-Position Dual-Row Header for Dense Board-to-Board Interconnects
The 20021121-00040C4LF is a 40-position, dual-row unshrouded header from the Minitek127® 1.27mm series by Amphenol ICC (FCI). It uses a 1.27mm pitch on both the row and column spacing, which sets the board footprint for a dense, space-efficient interconnect. The gold-plated mating interface (10µinch) provides reliable contact resistance over repeated mating cycles, while the tin-plated solder tails (50µinch) are compatible with standard lead-free reflow profiles.
SMT Termination with Pick-and-Place Ready Packaging
Termination is surface-mount solder, and the part ships in Tape & Reel packaging with a Pick and Place feature — meaning the header is vacuum-pickup compatible for automated placement.