Gold Mating Finish – 10.0 µin for Reliable Contact
The 20021211-00010T4LF: The mating interface is gold over copper alloy, 10.0 µin thick. Gold on the contact face resists oxidation and maintains stable contact resistance over repeated mating cycles — a practical choice for equipment that sees periodic board swaps or field service. The solder tails are tin-plated (50.0 µin) for good solderability.
Through-Hole Mount, Push-Pull Fastening
Insulation height is 0.213" (5.40 mm), so plan your board-to-board stack height accordingly.
Comparing Position Counts – 10 vs 8 Positions
The 20021212-00010T1LF is a right-angle variant of the same 10-position header, useful for board-edge routing where vertical clearance is tight.