20021221-00040C4LF Minitek127® Header 40-Pos 1.27mm
MPN20021221-00040C4LF
Active
FCI (Amphenol) Minitek127® 1.27mm board-to-board header, 40 positions, dual-row 0.050" pitch, SMT surface mount, 1A per contact at 125VAC, gold-over-copper mating contacts, tin post finish, push-pull push-pull shrouding, UL94 V-0, -55°C to 125°C, tape and reel.
$2.9203Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Minitek127® 1.27mm |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 125VAC |
| Current rating | 1A per Contact |
| Operating temperature | -55°C~125°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.220\" (5.60mm) |
| Insulation material | Thermoplastic |
All specifications
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tape & Reel (TR) |
| Features | Pick and Place |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 40 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.120\" (3.05mm) |
| Contact finish thickness - post | 50.0µin (1.27µm) |
| Contact finish thickness - mating | 10.0µin (0.25µm) |
Frequently asked questions
Where can I buy 20021221-00040C4LF and how do I get a price?
Quoted to order against your BOM quantity through independent distribution — submit an RFQ with the target quantity and required date to get current pricing and lead time.
What is the contact finish on the 20021221-00040C4LF?
Gold-over-copper on the mating face (10.0µin / 0.25µm) and tin on the solder post (50.0µin / 1.27µm) — the gold plating governs mating cycle life and contact resistance at first mate, while the tin post is sized for SMT wetting.