Board-to-Board Stacking with 1.27mm Pitch
The 20021321-00010C4LF: The 0.050" (1.27mm) pitch sets the footprint density — tight enough for signal routing in telecom or industrial boards, wide enough to keep per-contact current capacity reasonable. The gold layer handles moderate mating cycles — think field-serviceable equipment, not constant reconnection. The tin post finish matches typical SMT pad metallurgy for a reliable solder joint.
Surface Mount Assembly and Pick-and-Place Ready
Termination is solder-only, surface mount, with Pick and Place feature listed — the housing profile (0.177" insulation height) and flat top suit vacuum nozzle pickup. The tape-and-reel packaging supports automated assembly lines. Housing is UL94 V-0 rated plastic, black.
Base part number is 20021321. The suffix -00010C4LF indicates 10 positions with 10 µ" gold mating finish. Siblings include 12-position (-00012C4LF) and 16-position (-00016C4LF) variants with identical plating — useful if your layout needs more I/O without changing footprint pitch.
Selecting the Right Position Count
Compared to the 12-position 20021321-00012C4LF, this 10-position part shares the same 0.050" pitch, dual-row layout, gold mating finish, and SMT termination. The difference is purely position count — 10 vs 12 — so the board footprint length scales proportionally. For a 16-position need, the 20021321-00016C4LF is the next step up.