Board-to-Board Signal Interconnect at 1.27 mm Pitch
The 20021321-00014C1LF: The dual-row layout gives you 14 circuits in a compact footprint, and the SMT termination keeps the assembly on a standard reflow line.
Pitch and Footprint for Layout Engineers
The 1.27 mm pitch and 0.050" row spacing dictate the board footprint – the same pitch as the mating male header, so the via pattern and trace fan-out are symmetrical. The 4.50 mm insulation height gives a moderate stack height for mezzanine or parallel-board connections. Pick-and-place compatible packaging (Tape & Reel or Cut Tape) means this part feeds straight into an SMT line without manual handling.
RoHS compliant, with tin-plated solder posts and a phosphor bronze contact spring. The base product number is 20021321, so alternate plating or packaging variants share the same base.