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20021521-00020T4LF — Amphenol product photo

20021521-00020T4LF Amphenol ICC (FCI) Minitek127 20-Pin

MPN20021521-00020T4LF
Active

Amphenol ICC (FCI) Minitek127® 20021521 series, Board to Cable/Wire, 20 positions, 2 row, 0.050" (1.27mm) pitch, Surface Mount, Gold 10.0µin mating, UL94 V-0, Black, Tube.

$2.4200Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

20021521-00020T4LF Technical Specifications
ParameterValue
SeriesMinitek127® 20021521
GenderMale Pin
Mounting typeSurface Mount
Connector typeHeader
Fastening typePush-Pull
Voltage rating125VAC
Current rating1A per Contact
Operating temperature-40°C~105°C
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.220\" (5.60mm)
Insulation materialPlastic
Material flammability ratingUL94 V-0
StyleBoard to Cable/Wire
PackageTube
FeaturesKeying Slot
ShroudingShrouded - 4 Wall
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.050\" (1.27mm)
Positions20
Row spacing - mating0.050\" (1.27mm)
Contact finish - matingGold
Contact finish thickness - mating10.0µin (0.25µm)

Product details

1.27 mm Pitch, 20-Position SMD Header

The 20021521-00020T4LF: The 5.60 mm insulation height gives the board layout engineer a clear z-height budget for enclosure clearance.

Gold Mating Surface and Shrouded Housing

The mating contact finish is 10.0 µinch gold over copper alloy — rated for moderate reconnect duty in a field-service or production environment.

Peer Comparison: 20021521-00020T1LF vs This Part

The closest functional sibling is 20021521-00020T1LF — same 20 positions, same 1.27 mm pitch, same dual-row layout, same gold mating finish. The difference: T1LF carries flash gold on the mating contact (no measurable thickness), while this T4LF has a specified 10.0 µinch gold layer. For applications requiring a documented plating thickness — say, a customer print calling out 10 µinch minimum — T4LF is the correct call.

Termination is SMD solder — no through-hole, so the board footprint is entirely on the top layer.

Frequently asked questions

What is the mating connector for 20021521-00020T4LF?

It mates with a Minitek127 receptacle housing and matching crimp terminals. The 1.27 mm pitch and 20-position dual-row layout define the mating half — look for a 20-position receptacle from the same series.

What is the height of 20021521-00020T4LF above the board?

The insulation height is 0.220" (5.60 mm).