1.27 mm Pitch, 20-Position SMD Header
The 20021521-00020T4LF: The 5.60 mm insulation height gives the board layout engineer a clear z-height budget for enclosure clearance.
Gold Mating Surface and Shrouded Housing
The mating contact finish is 10.0 µinch gold over copper alloy — rated for moderate reconnect duty in a field-service or production environment.
Peer Comparison: 20021521-00020T1LF vs This Part
The closest functional sibling is 20021521-00020T1LF — same 20 positions, same 1.27 mm pitch, same dual-row layout, same gold mating finish. The difference: T1LF carries flash gold on the mating contact (no measurable thickness), while this T4LF has a specified 10.0 µinch gold layer. For applications requiring a documented plating thickness — say, a customer print calling out 10 µinch minimum — T4LF is the correct call.
Termination is SMD solder — no through-hole, so the board footprint is entirely on the top layer.