30 µinch gold — field-service mating cycle life
The 54101-G0826LF: The mating finish is 30 µinch gold over nickel, rated for repeated connect/disconnect cycles without exposing the base metal. The post finish is 100 µinch tin — a standard solderable surface for the through-hole joint.
Unshrouded, push-pull — no secondary lock
The header is unshrouded with a push-pull fastening — there is no latch, no TPA, no secondary retention. The mating receptacle must provide its own locking if the assembly sees vibration; for stationary board stacks or low-vibration enclosures, the friction fit of the pin-and-socket interface is sufficient. The 0.100" insulation height keeps the mated stack height low — useful when the board-to-board gap is tight.
-65°C to 125°C — wide thermal envelope
The operating temperature range spans -65°C to 125°C, covering automotive underhood, outdoor telecom cabinets, and industrial ovens without derating the current. The limiting factor at the high end is the solder joint creep, not the housing material — the UL94 V-0 rated black thermoplastic holds its mechanical properties across the full band.
Active production — no LTB clock
This part carries an Active lifecycle status. It is orderable through standard distribution — no end-of-life notice, no last-time-buy deadline. The base product number is 54101, which covers the single-row, unshrouded BERGSTIK® family; the G0826LF suffix specifies the 26-position, gold-plated variant.