Amphenol FCI BERGSTIK 54102-S30-04LF Header 8-Position Dual-Row, 3A
Amphenol FCI BERGSTIK 54102-S30-04LF, 8-position dual-row male header, 0.100" (2.54mm) pitch, through-hole solder termination, gold/GXT contact plating on mating face, tin post finish, 3A per contact, -65°C to 125°C operating range, UL94 V-0 housing.
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A per Contact |
| Operating temperature | -65°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
All specifications
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 8 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.538\" (13.67mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.318\" (8.08mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
Frequently asked questions
Who supplies 54102-S30-04LF and how is it quoted for volume purchases?
The part is sourced to order against the BOM quantity through independent distribution; RFQ confirms availability and current pricing at quote time — no live stock or price-per-unit is published on this listing.
What is 54102-S30-04LF's listed style on this component line?
The listed style is Board to Board or Cable — the dual-row unshrouded header is designed for board-to-board stacking or cable-to-board harness connections.
What is 54102-S30-04LF's listed series?
It is listed in the BERGSTIK series from Amphenol FCI — a long-running family of 0.100-inch pitch unshrouded headers used across industrial, instrumentation, and consumer electronics board-to-board applications.