Board Footprint and Current Budget
The 54102-T0808LF: Dual-row layout with 0.100" row spacing means the 16 positions occupy 0.800" of board edge, typical for a parallel-wire or IDC cable interface. Tin plating is cost-effective for fixed-wire or low-cycle use.
Unshrouded Through-Hole Build
Unshrouded header with push-pull fastening — no latch, no polarization key. The mating half must be oriented correctly during assembly; the square pins provide visual alignment. Through-hole termination gives mechanical hold against cable strain, better than an SMT header on the same footprint. The post sits flush in a 0.125" board — standard through-hole solder process.
