Amphenol ICC (FCI) BERGSTIK® unshrouded header, 8 positions, 0.100" (2.54 mm) pitch, surface-mount solder termination, tin-plated phosphor bronze contacts, UL94 V-0 black housing.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Gender | Male Pin |
| Mounting type | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 8 |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
The 54201-T0808LF: Surface-mount termination (SMT) allows reflow soldering alongside other SMD components, reducing assembly steps compared to through-hole.
This thick tin layer is suited for moderate mating-cycle applications — typically 50–100 cycles — and is cost-effective for high-volume designs.
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Designers need compatible connectors for board-to-board connections.