Surface Mount with Pick-and-Place Features
Terminated by solder reflow — the SMT tails sit flat on the board pads. The Pick and Place feature means the header is compatible with automated assembly: the flat top surface gives the vacuum nozzle a clean pick point, and the tape-and-reel packaging feeds directly into the placement machine.
30 µinch Gold Mating Contact, Tin Post
The solder post is tin-plated (100.0 µinch), which wets well with standard SAC305 solder.
