Footprint and routing fit
The 54202-G0807LF: Surface mount termination suits pick-and-place assembly and avoids the through-hole wave solder step. The unshrouded header gives board-level access for probing or stacking.
Current and contact durability
The tin-plated solder tail (100.0µin) ensures good wetting during reflow without gold embrittlement risk.
Temperature and compliance envelope
The 14-position 54202-G0807LF shares the same dual-row 0.100" pitch and SMT footprint as the 10-position 54202-G0805LF and 8-position 54202-G0804LF.
