Amphenol ICC (FCI) BERGSTIK® unshrouded header, 54202-S0804CLF, 8 positions, 0.100" (2.54 mm) pitch, dual-row, surface mount, 3 A per contact, gold-plated mating pins, UL94 V-0 black housing.
| Parameter | Value |
|---|---|
| Series | BERGSTIK® |
| Gender | Male Pin |
| Mounting type | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~130°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Features | Pick and Place |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 8 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
For signal-level loads — GPIO, I2C, SPI, sensor inputs — this is well within the margin.
The difference is in the packaging option — the ALF suffix adds Digi-Reel® availability. For a BOM that already specifies the CLF suffix, verify the packaging code before substituting.
Row spacing is also 0.100". This is a standard 0.100" grid header that mates with common IDC sockets and crimp receptacles.