BERGSTIK 55101-T1109LF — 9-Position Unshrouded Header
The FCI 55101-T1109LF is a 9-position, single-row unshrouded header from the BERGSTIK® series, designed for board-to-board interconnect applications. It uses the standard 0.100" (2.54mm) pitch, making it footprint-compatible with a wide range of legacy and current designs. The through-hole, right-angle mounting suits board-edge or space-constrained layouts where the connector axis runs parallel to the PCB. Rated at 5A per contact with a 110V voltage rating, it handles signal and moderate power duty. The tin-on-tin contact system — 100.0µin of tin on both the mating and post sides — is a cost-effective choice for applications with moderate mating cycle requirements, typical of internal board stacks or peripheral connections.
What the Ratings Mean for Your Fit
The 0.100" pitch is the de facto standard for many through-hole header applications — your board footprint needs to match this spacing, and the single-row layout keeps routing straightforward. The 5A per-contact rating is the thermal limit at room ambient; in a dense board stack or elevated-temperature enclosure, you'll want to derate per the manufacturer's curve. The right-angle orientation means the pins exit parallel to the board surface, which is useful when the mating receptacle approaches from the side rather than from above. The UL94 V-0 housing material meets the flame-rating requirement for equipment inside an enclosure, so no special handling is needed for compliance.