38-Position Board-to-Board Receptacle, 2.00mm Pitch
The 55508-138: The 2.00mm pitch and 0.079" row spacing set the PCB footprint for a compact, high-density interconnect. Applications include general-purpose, industrial, and medical equipment.
Available through independent distribution channels. Sourced per your BOM quantity against a quote.
The 0.091" (2.30mm) insulation height and dual-row layout require a matching header with a compatible stack height. Confirm the header's mated height against your board-to-board spacing budget before ordering.
Contact Finish and Reliability
Mating contacts are gold over phosphor bronze with 30.0µin gold thickness — this is a robust plating grade for applications requiring hundreds of mating cycles. For lead-free soldering requirements, a tin-plated post variant (if available in the series) would be needed — this specific order code carries tin-lead on the termination side.