30-Pin Dual-Row Receptacle at 2.00mm Pitch
The 2.00mm pitch sets the board footprint — each row is spaced 2.00mm apart, so the overall width across the two rows is about 4.00mm plus the housing walls. The gold layer is thin — rated for a few hundred mating cycles, enough for production-level assembly but not for repeated field reconnects.
Available through independent surplus and distribution channels.
The header must have 0.079" (2.00mm) row spacing to align. Termination is surface-mount solder; the contacts are female sockets that accept square header pins. The mating side is gold, so the interface is gold-to-gold or gold-to-tin depending on the header plating. If you're re-pinning an existing harness, the header's contact finish matters for corrosion resistance.