Board-to-Board Stacking on 2.00mm Pitch
The 57102-F02-24LF: The 2.00mm pitch and 0.079" (2.00mm) row spacing set a compact footprint — useful when routing density matters but the board stack height budget is generous enough for a through-hole solder tail.
The mating contact carries gold flash — a thin gold layer over the copper alloy base. The post is tin-plated, which is standard for solder-joint reliability. In a 48-position header, the total current per row is limited by the pin density and the PCB trace width — the 2A per-contact ceiling is conservative for signal-level loads but should be derated if all 48 pins carry current simultaneously in a warm enclosure.
The insulation height of 0.059" (1.50mm) is low, keeping the header profile minimal above the board surface.