2.00 mm pitch, 14 positions — board footprint and mate
The flash-grade gold handles occasional mate cycles — for repeated field-service mating, a thicker gold contact finish would extend cycle life, but for a board-to-board interconnect that mates once at assembly, this is the standard call. In a typical signal or low-power distribution role, each contact stays well within that envelope.
Through-hole solder termination, push-pull fastening
Suitable for stationary board-stacking where the mated pair isn't subject to repeated shock or cable strain.
Active production, RoHS compliant — sourcing posture
Active lifecycle status with RoHS compliance.
