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57102-F08-09LF

57102-F08-09LF Minitek Header 18-Pin 2.00mm

MPN57102-F08-09LF
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FCI by Amphenol 57102-F08-09LF, Minitek 2.00mm series dual-row board-to-board header, 18 positions, 0.079 inch (2.00mm) pitch, male pin, push-pull mating, gold on mating face, tin-plated solder posts, 2 A per circuit at 200 V, UL94 V-0 black thermoplastic housing, through-hole mount.

$1.5916Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026

Specifications

57102-F08-09LF key specifications
ParameterValue
SeriesMinitek® 2.00mm
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating200V (AC/DC)
Current rating2A (AC/DC)
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.059\" (1.50mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

57102-F08-09LF additional specifications
ParameterValue
StyleBoard to Board
PackageBox
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.079\" (2.00mm)
Positions18
Row spacing - mating0.079\" (2.00mm)
Contact finish - postTin
Contact length - post0.118\" (3.00mm)
Overall contact length0.335\" (8.51mm)
Contact finish - matingGold
Contact length - mating0.157\" (4.00mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - matingFlash

Frequently asked questions

What does the 57102-F08-09LF mate with?

The 57102-F08-09LF is the 18-position male header half of the Minitek 2.00mm series — it mates with the matching 18-position female receptacle housing in the same series, which carries the corresponding shroud, push-pull latch geometry, and square-socket contacts to accept the square pin.

Where is this connector typically used?

Minitek 2.00mm headers are used as board-to-board signal interconnects in compact instrumentation, industrial controls, and consumer electronics assemblies where mid-density stacking at 2.00mm pitch fits the z-height and routing budget.