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57102-F08-17ULF

57102-F08-17ULF Amphenol ICC Minitek 2.00mm Header 34-Pos

MPN57102-F08-17ULF
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Amphenol ICC (FCI) Minitek® 2.00mm header, order code 57102-F08-17ULF, 34 positions, dual row, 0.079" (2.00mm) pitch, 2A (AC/DC), 200V (AC/DC), gold-plated mating contacts, through-hole, solder termination.

$2.0086Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

57102-F08-17ULF key specifications
ParameterValue
SeriesMinitek® 2.00mm
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating200V (AC/DC)
Current rating2A (AC/DC)
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.059\" (1.50mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

57102-F08-17ULF additional specifications
ParameterValue
StyleBoard to Board
PackageTube
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.079\" (2.00mm)
Positions34
Row spacing - mating0.079\" (2.00mm)
Contact finish - postTin
Contact length - post0.118\" (3.00mm)
Overall contact length0.335\" (8.51mm)
Contact finish - matingGold
Contact length - mating0.157\" (4.00mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - matingFlash

Product details

34-circuit unshrouded header

The 57102-F08-17ULF is the 34-position member of Amphenol ICC's Minitek® 2.00mm board-to-board header line, an unshrouded dual-row through-hole part with gold-plated mating contacts. Rated 2A (AC/DC) per contact at 200V (AC/DC), the header uses a 0.079" (2.00mm) pitch and row spacing, with all 34 positions loaded.

Position count across the series

Within the Minitek® 2.00mm 57102 series, the 34-position 57102-F08-17ULF shares the 0.079" (2.00mm) pitch, dual-row layout, and unshrouded through-hole footprint with other position counts — match the circuit count to the board layout without changing the pad pattern.