Gold Flash Mating Surface, Tin Post
The 57102-F08-20LF: The solder post is finished with 78.7 µinch (2.00 µm) tin, which wets well during wave or hand soldering and is compatible with lead-free processes.
Amphenol ICC (FCI) Minitek® 2.00mm, Board to Board, Header, 40 Positions, 2 Rows, Through Hole, Solder, Unshrouded, Gold Flash Mating, Tin Post, 2 A, 200 V, UL94 V-0
| Parameter | Value |
|---|---|
| Series | Minitek® 2.00mm |
| Gender | Male Pin |
| Mounting type | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 200V (AC/DC) |
| Current rating | 2A (AC/DC) |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Box |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 40 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.118\" (3.00mm) |
| Overall contact length | 0.335\" (8.51mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.157\" (4.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | Flash |
The 57102-F08-20LF: The solder post is finished with 78.7 µinch (2.00 µm) tin, which wets well during wave or hand soldering and is compatible with lead-free processes.
Design engineers need the correct receptacle to ensure pin-to-socket fit.
Sourcing buyers need to find immediate availability to avoid production delays.
Procurement requires up-to-date pricing and delivery time to manage BOM costs.
Engineers may need to substitute similar parts if one is out of stock.
Layout engineers need the exact PCB footprint to design the board correctly.
Maintenance techs verifying compatibility when replacing a connector in the field.