The 57102-G06-10LF: The 2.00 mm pitch (0.079") on both rows sets the board footprint — the 20 positions occupy a 19.00 mm wide row, and the 2.00 mm row spacing means the outer pin rows sit 2.00 mm apart centre-to-centre. This is a standard density for signal-level interconnects; the 2 A per contact rating keeps temperature rise within the UL94 V-0 thermoplastic housing limit at ambient up to 85 °C. The unshrouded design leaves the square male pins exposed — mating alignment relies on the receptacle's shroud, so the header must be board-mounted with ±0.10 mm positional accuracy to avoid pin stubbing.
Mating Interface and Contact Durability
The post finish is tin, which solders reliably into the plated through-hole.