Board-to-Board Signal Header with 2.00 mm Pitch
The unshrouded design with push-pull fastening allows easy manual mating and unmating, though it offers less mechanical polarization than a shrouded header.
Dual-Row Layout and Contact Geometry
This geometry is standard for through-hole soldering into a 1.6 mm thick PCB. The tin post finish ensures good solderability with standard lead-free reflow profiles, while the gold mating surface resists oxidation in environments with moderate humidity or industrial atmospheres.