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57102-G06-19ULF

57102-G06-19ULF Amphenol ICC Minitek® 2.00mm 38-Pin Header

MPN57102-G06-19ULF
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Amphenol ICC (FCI) Minitek® 2.00mm, 38-position, dual-row unshrouded header, through-hole solder termination, gold GXT™ mating finish, 2 A per contact, 200 V AC/DC.

$2.6299Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

57102-G06-19ULF key specifications
ParameterValue
SeriesMinitek® 2.00mm
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating200V (AC/DC)
Current rating2A (AC/DC)
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.059\" (1.50mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

57102-G06-19ULF additional specifications
ParameterValue
StyleBoard to Board
PackageTube
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.079\" (2.00mm)
Positions38
Row spacing - mating0.079\" (2.00mm)
Contact finish - postTin
Contact length - post0.098\" (2.50mm)
Overall contact length0.315\" (8.00mm)
Contact finish - matingGold, GXT™
Contact length - mating0.157\" (4.00mm)
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

What It Connects To and Where It Goes

The 57102-G06-19ULF: As a board-to-board header, it mates with a matching Minitek® 2.00mm receptacle (female socket) on a parallel PCB. The push-pull fastening and unshrouded design mean the header is typically used in low-vibration, internal board-stacking applications where the mated pair is not subject to cable strain or frequent unmating.

Frequently asked questions

What is the mounting type for 57102-G06-19ULF?

Through-hole solder termination. The 0.098" (2.50 mm) post length provides adequate stand-off for solder fillet formation.