Amphenol FCI Minitek 57102-G06-25ULF Header 50-Pin 2A
Amphenol FCI Minitek 2.00mm dual-row male header, 50 positions, 2.00mm pitch, 2 A per circuit at 200 V AC/DC, through-hole solder termination, gold GXT contact plating on mating face, tin-plated solder tails, push-pull fastening, UL94 V-0 black thermoplastic, 0.059 inch insulation height.
Specifications
| Parameter | Value |
|---|---|
| Series | Minitek® 2.00mm |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 200V (AC/DC) |
| Current rating | 2A (AC/DC) |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 50 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.098\" (2.50mm) |
| Overall contact length | 0.315\" (8.00mm) |
| Contact finish - mating | Gold, GXT™ |
| Contact length - mating | 0.157\" (4.00mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
Where can I buy 57102-G06-25ULF and how do I get a price?
The 57102-G06-25ULF is sourced and quoted to order against the BOM quantity through independent distribution; availability and current pricing are confirmed at quote time.
What is 57102-G06-25ULF's listed series on this component line?
The 57102-G06-25ULF belongs to the Minitek 2.00mm series from Amphenol FCI — a dual-row 2.00mm pitch board-to-board header family used across industrial and consumer electronics applications.
What is 57102-G06-25ULF's listed style?
The listed style for the 57102-G06-25ULF is Board to Board — the connector is designed for board-to-board stacking or mezzanine interconnects with through-hole solder termination.