Board-to-Board Fit: 2.00mm Pitch, 22 Positions, Dual-Row
The 57102-G08-11LF: The 0.157" (4.00mm) mating contact length provides a solid wipe before the push-pull interface engages, and the 0.118" (3.00mm) solder tail length suits standard through-hole PCB thicknesses. Overall contact length is 0.335" (8.51mm).
Gold GXT™ Plating: 30 µinch Mating Surface
Current and Voltage: Signal-Level Duty
The copper alloy contact material and square pin shape (0.079" x 0.079" typical for 2.00mm pitch) keep contact resistance low across the signal path.
Mounting and Orientation: Through-Hole, Unshrouded
Insulation height is only 0.059" (1.50mm) above the board, saving z-height in tight enclosures.